Massy,
France-based Alchimer S.A. says it has recently signed an agreement
with Kromax International Corp., a Taiwanese company that represents
leading semiconductor and flat-panel equipment manufacturers and
material suppliers in the Asian market.
Kromax
will represent Alchimer’s total through-silicon via (TSV) solution in
Taiwan, including its Electrografting (eG) wet deposition technology.
Electrografting is Alchimer’s electrochemical process that enables the
growth of extremely high-quality nanometric films for TSVs,
semiconductor interconnects, MEMS and other electronic applications.
“This
is further recognition in one of the most important chip-producing
markets that Alchimer’s mature technology is recognized as a
cost-effective solution for high aspect ratio TSVs, and we are pleased
to announce this expansion of sales and service for our Taiwanese
customers,” says Steve Lerner, Alchimer CEO.
According
to Kell Hwant, chairman of Kromax, the selection of Alchimer’s
wet-deposition process was based on its solid demonstration as a leading
solution for cost-effective, conformal high-aspect ratio TSVs.
“Kromax
is pleased to add Alchimer to our portfolio of leading tool and
materials companies serving the IC and flat-panel markets,” said Kell
Hwang, chairman of Kromax. “The company’s wet-deposition process has
been solidly demonstrated as a leading solution for cost-effective,
conformal high-aspect ratio TSVs.”
Alchimer’s
expansion in Taiwan follows closely on the revenue success it has had
in both South Korea and Japan, where it also has agreements with
regional firms.
Electrografting
(eG), is an electrochemical-based process that enables the growth of
very thin coatings, of various types, on both conducting and
semiconducting surfaces. The technology, developed by Alchimer, has
allowed the company to develop chemical formulations, processes and IP
for the deposition of nanometric films used in a variety of
microelectronic and MEMS applications, including wafer-level
interconnects and TSVs for 3D packaging.
