Research & Development World

  • Home Page
  • Topics
    • Aerospace
    • Archeology
    • Automotive
    • Biotech
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Market Pulse
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Battery Technology
    • Imaging
    • Nanotechnology
    • Semiconductors
  • Controlled Environments
    • Cleanrooms
    • Graphene
    • Lasers
    • Regulations/Standards
    • Sensors
  • Scientific Computing
    • Big Data
    • HPC/Supercomputing
    • Informatics
    • Security
    • Software
  • R&D 100 Awards
    • ENTER NOW
    • 2020 Winners
    • Winner Archive
    • R&D 100 Conference
  • Resources
    • Digital Issues
    • Podcasts
    • Subscribe
  • 2021 Funding Forecast
  • COVID-19

‘Cyber Eye’ Takes Nearly Any Shape

By R&D Editors | September 5, 2008

‘Cyber Eye’ Takes Nearly Any Shape

Instead of using a flat microchip as the light sensor for their new camera, a team of engineers has developed a sensor that is a flexible mesh of

The electronic eye camera
The electronic eye camera . The array of pixels is visible through the magnified image created by the lens. Courtesy of Beckman Institute, U of I

wire-connected pixels. The mesh is made from many of the same materials as a standard digital-camera sensor, but has the unique ability to conform to convoluted, irregular surfaces.

The technology is already showing promise for photography, as the researchers conformed the array to a hemispherical shape and incorporated the device into a working eye-like camera. The new system eliminates some of the aberrations caused by current camera designs and improves the quality of captured images. Researchers are testing the same design principles in a range of other applications, including as a thin, conformable monitor to detect electrical signals traveling across the undulating surface of the human brain.

Led by John Rogers of the University of Illinois at Urbana-Champaign and Yonggang Huang of Northwestern University in Evanston, IL, the researchers announced their findings August 7, 2008, in the journal Nature.

"This research is truly transformative," said Ken Chong, advisor in the National Science Foundation (NSF) Engineering Directorate, who is one of the officers overseeing the

Image obtained using electronic eye camera
This color picture of an eye is an actual image obtained with the new 256-pixel electronic eye camera. The curved surface rendering at the top corresponds to the image extracted directly from the camera, while a planar projection of the image appears below. Courtesy of Beckman Institute, U of I 

researchers' NSF grant. "Using simple mechanics principles, the researchers have produced, for the first time, electronic devices on a hemispherical surface so that they can take images much like those captured by the human eye."

The novel approach bypasses a traditional planar sensor of adjacent pixels and instead relies upon an array of pixels interconnected by small wires. Using a flexible, temporary backing, the researchers can form the array into a curved shape and then transfer the array to its permanent location affixed to a glass lens. Over the last 20 years, many researchers have tried to manufacture such electronic eye systems but, until now, none were able to create a working camera.

"This strategy opens up exciting, new engineering design possibilities by eliminating the two-dimensional, planar constraints of conventional, semiconductor wafer-based optoelectronics," said John Rogers, Flory-Founder Chair Professor of Materials Science and Engineering at University of Illinois at Urbana/Champaign.

Stage in the electronic eye fabrication process
This image, captured during the electronic eye fabrication process, shows a silicon focal plane array (dark brown) and electronics on a hemispherical transfer element (translucent). Courtesy of Beckman Institute, U of I 

While a flat, planar sensor cannot flex without damaging its light-sensitive pixels, the new technology puts the strain on the wires, each flexing as much as 40 percent. Since the wires absorb the strain, the pixels are barely stressed, even when affixed to the retina-shaped housing of the new experimental camera. Conventional digital cameras use planar chips based on rigid, brittle semiconductor wafer substrates that fracture at strains of less than one percent.

"Mechanics helps to reduce the stresses and strain in components, and guide and optimize the system design," said Yonggang Huang, Joseph Cummings Professor of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, who worked with his team to model the mechanical properties of the design so that it could be manufactured.

The current sensor array includes only 256 pixels but, because the technology is based on established materials and manufacturing processes, the researchers ultimately expect more sophisticated sensors in higher density arrays. The same approaches can be used for nearly any class of semiconductor electronic device for a range of functions such as sensing, actuating and computing.

"We believe that some of the most compelling areas of future application involve the intimate, conformal integration of electronics with the human body, in ways that are inconceivable using established technologies," said Rogers, who also is affiliated with the Beckman Institute for Advanced Science and Technology and the Frederick Seitz Materials Research Laboratory. "We are working actively with collaborators to explore possibilities in advanced health monitors, prosthetic devices and therapeutic systems.

The electronic eye research emerged in part from the collaborative activities of the Center for Nano-Chemical-Electrical-Mechanical Manufacturing Systems (Nano-CEMMS).

Silicon photodetector pixels and electronics connected by arc-shaped ribbons, view 1
Low magnification scanning electron micrograph of a collection of silicon photodetector pixels and electronics interconnected by arc-shaped ribbons, on a hemispherical substrate. These interconnects bow upward to accommodate the large mechanical strains needed to transform the planar layouts in which the systems are initially fabricated to the hemispherical geometries needed for implementation in the electronic eye. The image is colorized: pixel elements and interconnects appear gold; the substrate appears light blue. Courtesy of Beckman Institute, U of I 

Silicon photodetector pixels and electronics connected by arc-shaped ribbons, view 2
This high magnification scanning electron micrograph shows a small cluster of silicon photodetector pixels and electronics interconnected by arc-shaped ribbons, all on a hemispherical substrate. These interconnects bow upward to accommodate the large mechanical strains needed to transform the planar layouts in which the systems are initially fabricated to the hemispherical geometries needed for implementation in the electronic eye. The image is colorized: pixel elements and interconnects appear gold; the substrate appears light blue. Courtesy of Beckman Institute, U of I

Silicon photodetector pixels and electronics connected by arc-shaped ribbons, view 3
A close-up view of the silicon photodetector pixels and electronics interconnected by arc-shaped ribbons. The scale bar represents 10 micrometers. Courtesy of Northwestern University, U of I 

Related Articles Read More >

R&D 100 winner of the day: CyberPow: Cyber Sensing for Power Outage Detection
Cambridge Quantum Computing launches first cloud-based Quantum Random Number Generation Service with verification in partnership with IBM
Purdue University to collaborate in NSF-funded Engineering Research Center to develop the IoT for Precision Agriculture
PicoScope 6000E Series: a smarter scope for faster debug

Need R&D World news in a minute?

We Deliver!
R&D World Enewsletters get you caught up on all the mission critical news you need in research and development. Sign up today.
Enews Signup
Tweets by @RandDWorld

R&D World Digital Issues

February 2020 issue

Browse the most current issue of R&D World and back issues in an easy to use high quality format. Clip, share and download with the leading R& magazine today.

Research & Development World
  • Subscribe to R&D World Magazine
  • Enews Sign Up
  • Contact Us
  • Drug Discovery & Development
  • Pharmaceutical Processing
  • 2021 Global Funding Forecast

Copyright © 2021 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search R&D World

  • Home Page
  • Topics
    • Aerospace
    • Archeology
    • Automotive
    • Biotech
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Market Pulse
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Battery Technology
    • Imaging
    • Nanotechnology
    • Semiconductors
  • Controlled Environments
    • Cleanrooms
    • Graphene
    • Lasers
    • Regulations/Standards
    • Sensors
  • Scientific Computing
    • Big Data
    • HPC/Supercomputing
    • Informatics
    • Security
    • Software
  • R&D 100 Awards
    • ENTER NOW
    • 2020 Winners
    • Winner Archive
    • R&D 100 Conference
  • Resources
    • Digital Issues
    • Podcasts
    • Subscribe
  • 2021 Funding Forecast
  • COVID-19