Plasma, a gaseous mixture of atoms, molecules, ions, and free electrons, allows for efficient surface treatment of electronic components and parts made of different materials.
In this, organic contaminations such as oils and greases are cleaned and simultaneously the surface is activated. This double function is based on a physical and chemical reaction of the procedure. Depending on the application case, low pressure plasmas or inline-compatible atmospheric pressure plasmas are used. Using the former, it is possible to implement both oxidizing and reducing processes. Within the oxidizing plasma, organic contaminations such as greases, oils, and adhesive residua can be removed before soldering or bonding. Reducing plasma processes are mainly used to optimize bond connections by means of reducing galvanically applied metal layers. In the electronics industry, processes of surface cleaning and activation by means of atmospheric pressure plasmas are used before printing, before gluing, or before pouring electronic printed circuit boards and semiconductors, in the field of optoelectronic component production, as well as before wire bonding. A joint project also deals with barrier coatings by means of inline-compatible atmospheric pressure plasmas for selective ageing and corrosion protection of electronic components.
