Purge with gas ionized by an inline electrical ionizer can effectively neutralize charges on wafers in a FOUP, reducing the chance of ESD occurrence.
With a full load of wafers, it can reduce the charge level on a wafer from 1,000 v/cm to about 100 v/cm within five minutes. Ion trapping components such as filters should be avoided to minimize loss of ions before they reach the inside of the FOUP. It is possible that the same idea can be applied for neutralizing charges on a reticle stored in a reticle pod, which will be studied and reported in the future.
From: Purge Micro-Environment With Ionized Air to Reduce Chances of ESD Damages to Wafers