Barry Industries presents its line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six sizes from 3 to 8 mm with standard JEDEC MO-220 footprints and feature broadband low-loss transitions. Maximum insertion loss is 0.5dB from DC to 18GHz, 1.5dB from 18 to 35GHz. and 4dB from 35 to 40GHz. The packages are available with either a plain seal for epoxy or metallized grounded seal ring for solder lid attachment. Lids are available from the factory. Additional options include castellations and custom pin counts. Standard plating is gold over nickel.