Research & Development World

  • R&D World Home
  • Topics
    • Aerospace
    • Automotive
    • Biotech
    • Careers
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Software
    • Battery Technology
    • Controlled Environments
      • Cleanrooms
      • Graphene
      • Lasers
      • Regulations/Standards
      • Sensors
    • Imaging
    • Nanotechnology
    • Scientific Computing
      • Big Data
      • HPC/Supercomputing
      • Informatics
      • Security
    • Semiconductors
  • R&D Market Pulse
  • R&D 100
    • Call for Nominations: The 2025 R&D 100 Awards
    • R&D 100 Awards Event
    • R&D 100 Submissions
    • Winner Archive
    • Explore the 2024 R&D 100 award winners and finalists
  • Resources
    • Research Reports
    • Digital Issues
    • R&D Index
    • Subscribe
    • Video
    • Webinars
  • Global Funding Forecast
  • Top Labs
  • Advertise
  • SUBSCRIBE

Research team to develop energy-efficient 3D CPU

By R&D Editors | November 15, 2011

Researchers from North
Carolina State University are developing a 3D central
processing unit (CPU) with the goal of boosting energy efficiency by 15 to 25%.
The work is being done under a $1.5 million grant from the Intel Corporation.

The computer industry has a great deal of interest in 3D integrated
circuits, which are vertically integrated chips that are connected by vertical
electronic connections—called through silicon vias—that pass through silicon
wafers. These 3D circuits would represent an advance over conventional computer
chips, which operate in only two dimensions.

“Under this grant, we are building a 3D CPU chip stack and will be solving
some of the problems currently facing the development of 3D CPUs,” says Paul
Franzon, PhD, a professor of electrical and computer engineering at NC State
and lead researcher on the project.

One problem the researchers plan to address is how to reconcile chips that
are designed and manufactured in different places to different specifications
so that they can work together in three dimensions. They will also address
questions concerning heat dissipation, since the 3D nature of the design would
otherwise lead to much higher temperatures within the machine.

“Our goal is to achieve at least a 15% improvement in performance per unit
of power, through architectural and circuit advances,” Franzon says.

The researchers plan to have a complete prototype developed in 2014, and
will also be addressing “test and yield” challenges—such as how manufacturers
can test individual CPU components to ensure they are functional. These
challenges are key to facilitating the manufacture of 3D CPUs.

In addition to Franzon, the research team includes Eric Rotenberg and Rhett
Davis, a professor and associate professor, respectively, of electrical and
computer engineering at NC State; and Krishnendu Chakrabarty, PhD, of Duke
University.

SOURCE

Related Articles Read More >

2025 R&D layoffs tracker tops 92,000
Eli Lilly facility
9 R&D developments this week: Lilly builds major R&D center, Stratolaunch tests hypersonic craft, IBM chief urges AI R&D funding
Five cases where shaky science snowballed into public confusion
Caltech, Fermilab, and collaborators test quantum sensors for future particle physics experiments
rd newsletter
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, trends, and strategies in Research & Development.
RD 25 Power Index

R&D World Digital Issues

Fall 2024 issue

Browse the most current issue of R&D World and back issues in an easy to use high quality format. Clip, share and download with the leading R&D magazine today.

Research & Development World
  • Subscribe to R&D World Magazine
  • Enews Sign Up
  • Contact Us
  • About Us
  • Drug Discovery & Development
  • Pharmaceutical Processing
  • Global Funding Forecast

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search R&D World

  • R&D World Home
  • Topics
    • Aerospace
    • Automotive
    • Biotech
    • Careers
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Software
    • Battery Technology
    • Controlled Environments
      • Cleanrooms
      • Graphene
      • Lasers
      • Regulations/Standards
      • Sensors
    • Imaging
    • Nanotechnology
    • Scientific Computing
      • Big Data
      • HPC/Supercomputing
      • Informatics
      • Security
    • Semiconductors
  • R&D Market Pulse
  • R&D 100
    • Call for Nominations: The 2025 R&D 100 Awards
    • R&D 100 Awards Event
    • R&D 100 Submissions
    • Winner Archive
    • Explore the 2024 R&D 100 award winners and finalists
  • Resources
    • Research Reports
    • Digital Issues
    • R&D Index
    • Subscribe
    • Video
    • Webinars
  • Global Funding Forecast
  • Top Labs
  • Advertise
  • SUBSCRIBE