Roth & Rau-Ortner offers the FOUP Purge System that protects wafers from airborne molecular contamination and other chemical reactions. The purging system is especially aimed at semiconductor manufacturing process nodes of 28nm and below where minor contaminants can add excess time and costs to the development cycle.
FOUP (Front Opening Unified Pod) is a specialized enclosure designed to hold silicon wafers in a controlled environment between process steps. The FOUP Purge System floods the FOUP with a constant flow of nitrogen during the interim storage period, flushing out harmful contaminants that can damage wafer surfaces.
Purging is a critical step and traditionally required a separate tool in the fab. Since the FOUP Purge System can be retrofitted to existing storage modules, the purging process no longer needs a separate station.
Roth & Rau-Ortner