Embedded Microjet Cooling for High-Power Electronics
Category: Mechanical/Materials
Developers: MIT Lincoln Laboratory
United States
Product Description:Further advances in high-power electronics require high-performance, co-packaged thermal solutions. Microjet cooling achieves this with arrays of 100-micron-scale liquid jets embedded within the device substrate itself, generating world-class cooling performance without bulky heat sinks or spreaders and allowing for higher-power operation at lower temperatures.
Developers: MIT Lincoln Laboratory
United States
Product Description:Further advances in high-power electronics require high-performance, co-packaged thermal solutions. Microjet cooling achieves this with arrays of 100-micron-scale liquid jets embedded within the device substrate itself, generating world-class cooling performance without bulky heat sinks or spreaders and allowing for higher-power operation at lower temperatures.
Figure 1