Embedded Microjet Cooling for High-Power Electronics
Established in 1963, the R&D 100 Awards is the only S&T (science and technology) awards competition that recognizes new commercial products, technologies, and materials for their technological significance that are available for sale or license. The R&D 100 Awards, celebrating the program's 60th Anniversary this year, has long been a benchmark of excellence for industry sectors as diverse as telecommunications, high-energy physics, software, manufacturing, and biotechnology. This 2022 R&D 100 winner is listed below, along with its respective category.
Category: Mechanical/Materials
Developers: MIT Lincoln Laboratory
United States
Product Description:Further advances in high-power electronics require high-performance, co-packaged thermal solutions. Microjet cooling achieves this with arrays of 100-micron-scale liquid jets embedded within the device substrate itself, generating world-class cooling performance without bulky heat sinks or spreaders and allowing for higher-power operation at lower temperatures.
Developers: MIT Lincoln Laboratory
United States
Product Description:Further advances in high-power electronics require high-performance, co-packaged thermal solutions. Microjet cooling achieves this with arrays of 100-micron-scale liquid jets embedded within the device substrate itself, generating world-class cooling performance without bulky heat sinks or spreaders and allowing for higher-power operation at lower temperatures.
Figure 1