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Embedded Microjet Cooling for High-Power Electronics

Category: Mechanical/Materials
Developers: MIT Lincoln Laboratory
United States

Product Description:Further advances in high-power electronics require high-performance, co-packaged thermal solutions. Microjet cooling achieves this with arrays of 100-micron-scale liquid jets embedded within the device substrate itself, generating world-class cooling performance without bulky heat sinks or spreaders and allowing for higher-power operation at lower temperatures.

Figure 1

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