EvoRTS: Revolutionizing AI-Chip Packaging with Flux and Void Elimination
Category: Other
Developers: AblePrint Technology Co., Ltd.
Product Description:EvoRTS integrates flux residue removal and void elimination simultaneously in one oven, using optimized temperature and pressure for dissolution, diffusion, and disturbance, streamlines operations and boosts efficiency. This void-free, residue-free process significantly enhances advanced AI-Chip packaging reliability, accelerates production cycles, cuts costs, and conserves water, energy, and gas resources. The system simultaneously removes solder flux residues and eliminates voids during the underfill curing process using precise thermal and pressure control. Unlike traditional methods that require multiple cleaning steps such as water washing, baking, or plasma treatment, EvoRTS integrates cleaning and curing into one streamlined operation. The system employs three synergistic mechanisms: dissolution to break down flux molecules, diffusion to spread them evenly, and disturbance to create dynamic fluid motion that flushes residues and collapses voids in real time. This approach improves process reliability and package integrity, while also enhancing yield and operational efficiency. By eliminating the need for separate cleaning tools, EvoRTS reduces production cycle time by 30 percent and cuts water, energy, and gas consumption by up to 40 percent. It is ideally suited for high-performance AI and HPC devices, offering a clean, void-free, and cost-effective packaging solution with superior long-term reliability.
Developers: AblePrint Technology Co., Ltd.
Product Description:EvoRTS integrates flux residue removal and void elimination simultaneously in one oven, using optimized temperature and pressure for dissolution, diffusion, and disturbance, streamlines operations and boosts efficiency. This void-free, residue-free process significantly enhances advanced AI-Chip packaging reliability, accelerates production cycles, cuts costs, and conserves water, energy, and gas resources. The system simultaneously removes solder flux residues and eliminates voids during the underfill curing process using precise thermal and pressure control. Unlike traditional methods that require multiple cleaning steps such as water washing, baking, or plasma treatment, EvoRTS integrates cleaning and curing into one streamlined operation. The system employs three synergistic mechanisms: dissolution to break down flux molecules, diffusion to spread them evenly, and disturbance to create dynamic fluid motion that flushes residues and collapses voids in real time. This approach improves process reliability and package integrity, while also enhancing yield and operational efficiency. By eliminating the need for separate cleaning tools, EvoRTS reduces production cycle time by 30 percent and cuts water, energy, and gas consumption by up to 40 percent. It is ideally suited for high-performance AI and HPC devices, offering a clean, void-free, and cost-effective packaging solution with superior long-term reliability.
