TESCAN AMBER X 2
Category: Analytical/Test
Developers: TESCAN Group
Product Description:AMBER X2 is reportedly the first Plasma FIB-SEM that combines large-scale 3D characterization and precise TEM specimen preparation. Powered by the new Mistral PFIB and BrightBeam field-free SEM, AMBER X2 uniquely combines low-keV SEM field-free imaging, large-scale and precise Plasma FIB milling, with multi-modal FIB-SEM Tomography integrated analytical techniques. TESCAN AMBER X 2 is a disruptive plasma FIB-SEM platform that transforms how researchers perform 3D materials analysis and TEM specimen preparation. It replaces the need for separate plasma and Ga⁺ systems by introducing a new Mistral Plasma FIB column. The AMBER X 2 can provide insight into structure and chemistry, empowering advances in semiconductors, batteries, and nanomaterials. TESCAN AMBER X 2 provides researchers with the ability to perform fast, large-volume, nanoscale materials 2D/3D characterization while achieving precision for sub-30 nm thin TEM specimen fabrication with a benefit of a Xe Plasma Ion Source (minimal damage to the TEM specimen and no risk of Ga+ ion specimen contamination), all within a single, integrated FIB-SEM platform. It eliminates the traditional need for separate systems (plasma FIB for volume and Ga+ FIB for TEM prep) by combining high-throughput milling, low-energy and high-energy precision milling and polishing.
Developers: TESCAN Group
Product Description:AMBER X2 is reportedly the first Plasma FIB-SEM that combines large-scale 3D characterization and precise TEM specimen preparation. Powered by the new Mistral PFIB and BrightBeam field-free SEM, AMBER X2 uniquely combines low-keV SEM field-free imaging, large-scale and precise Plasma FIB milling, with multi-modal FIB-SEM Tomography integrated analytical techniques. TESCAN AMBER X 2 is a disruptive plasma FIB-SEM platform that transforms how researchers perform 3D materials analysis and TEM specimen preparation. It replaces the need for separate plasma and Ga⁺ systems by introducing a new Mistral Plasma FIB column. The AMBER X 2 can provide insight into structure and chemistry, empowering advances in semiconductors, batteries, and nanomaterials. TESCAN AMBER X 2 provides researchers with the ability to perform fast, large-volume, nanoscale materials 2D/3D characterization while achieving precision for sub-30 nm thin TEM specimen fabrication with a benefit of a Xe Plasma Ion Source (minimal damage to the TEM specimen and no risk of Ga+ ion specimen contamination), all within a single, integrated FIB-SEM platform. It eliminates the traditional need for separate systems (plasma FIB for volume and Ga+ FIB for TEM prep) by combining high-throughput milling, low-energy and high-energy precision milling and polishing.
