HSG Thermal Management Pad
Established in 1963, the R&D 100 Awards is the only S&T (science and technology) awards competition that recognizes new commercial products, technologies, and materials for their technological significance that are available for sale or license. The R&D 100 Awards, celebrating the program's 60th Anniversary this year, has long been a benchmark of excellence for industry sectors as diverse as telecommunications, high-energy physics, software, manufacturing, and biotechnology. This 2022 R&D 100 winner is listed below, along with its respective category.
Category: Mechanical/Materials
Developers: Nano and Advanced Materials Institute Nano and Advanced Materials Institute
Co-Developers: HFC Industry Ltd.
Hong Kong (Greater China)
Product Description:Design for superior thermal management equipped with high frequency electromagnetic (EM) wave shielding ability. HSG series thermal conductive pad, based on superparamagnetic nanoparticles induced graphite as thermal conductive fillers, provides 2-4 folds increase in thermal conductivity and outperforming EM wave shielding ability (30-50dB), leading the current product in the market.
Developers: Nano and Advanced Materials Institute Nano and Advanced Materials Institute
Co-Developers: HFC Industry Ltd.
Hong Kong (Greater China)
Product Description:Design for superior thermal management equipped with high frequency electromagnetic (EM) wave shielding ability. HSG series thermal conductive pad, based on superparamagnetic nanoparticles induced graphite as thermal conductive fillers, provides 2-4 folds increase in thermal conductivity and outperforming EM wave shielding ability (30-50dB), leading the current product in the market.
HSG Thermal Management Pad_Application on Chip