HSG Thermal Management Pad
Category: Mechanical/Materials
Developers: Nano and Advanced Materials Institute Nano and Advanced Materials Institute
Co-Developers: HFC Industry Ltd.
Hong Kong (Greater China)
Product Description:Design for superior thermal management equipped with high frequency electromagnetic (EM) wave shielding ability. HSG series thermal conductive pad, based on superparamagnetic nanoparticles induced graphite as thermal conductive fillers, provides 2-4 folds increase in thermal conductivity and outperforming EM wave shielding ability (30-50dB), leading the current product in the market.
Developers: Nano and Advanced Materials Institute Nano and Advanced Materials Institute
Co-Developers: HFC Industry Ltd.
Hong Kong (Greater China)
Product Description:Design for superior thermal management equipped with high frequency electromagnetic (EM) wave shielding ability. HSG series thermal conductive pad, based on superparamagnetic nanoparticles induced graphite as thermal conductive fillers, provides 2-4 folds increase in thermal conductivity and outperforming EM wave shielding ability (30-50dB), leading the current product in the market.
HSG Thermal Management Pad_Application on Chip