Osram Opto Semiconductors is switching its fabrication of red, orange, and yellow light emitting diodes to 6-inch wafers. The German high-tech company is extending the fabrication of all large-wafer LEDs to the indium-gallium-aluminum-phosphide (InGaAlP) material system and therefore expanding its production capacity. The company began switching fabrication of blue LED chips back in 2011.
The latest switch involves chips for LEDs intended for a wide range of applications. Red and yellow LEDs are used in virtually every sector: as turn indicators, brake lights, and interior vehicle lighting in the automotive sector, in displays, for projection, for signage, and for color mixing systems in general illumination. The Regensburg-based company was the first manufacturer to switch all LED colors worldwide to 4-inch wafers many years ago and is now continuing this approach with 6-inch wafers.
“The demand for light emitting diodes in red, orange and yellow continues to grow. We are keeping pace with this demand by being the first manufacturer in the world to switch fabrication to 6-inch wafers – thereby also expanding our capacity,” says Aldo Kamper, CEO of Osram Opto Semiconductors. “The switch will involve all product families and was initiated at the start of the year.”
The red, yellow, and orange chips will be fabricated at the company headquarters in Regensburg. InGaN chips for blue, green and white LEDs are also produced there, as well as in Penang, Malaysia.
Experience from 6-inch wafer production so far has flowed directly into the current process – as have the results from the projects funded by the German Federal Ministry of Education and Research (the “GallEff” project and the “Greight” project for scaling indium-gallium-nitride wafers).
Release Date: January 30, 2014
Source: Osram Opto Semiconductors