Rofin offers a turnkey solution for front-end-of-line processing in the semiconductor market – the Waferlase 200/300/450, a laser wafer-processing system.
Waferlase 200/300/450 is an automated modular platform comprised of a handling system for ultra-thin semiconductor wafers and a choice of laser processing modules, depending on the type of application. The product family starts with solutions for insulated-gate bipolar transistor laser-annealing and debris-free wafer-marking.
The product’s wafer-handling technology provides non-contact transportation of ultra-thin wafers, even with considerable warpage and bow. The system comes with two or more cassette ports for Open Cassette or Front-Opening Unified Pod (FOUP) wafer-carrier systems. Scanners detect the position of the wafer in its carrier. The system software controls slot allocation, wafer warpage measurement, wafer location, and wafer identification (ID) detection.
The Waferlase 200/300/450 systems produce traceable markings on transparent, semitransparent, and opaque wafer materials. Two methods (i.e., hard and debris-free marking) are used; they differ in terms of process, depth, and location of the mark. Debris-free marking in a cleanroom environment is achieved by melting the silicon wafer’s surface.