Research & Development World

  • R&D World Home
  • Topics
    • Aerospace
    • Automotive
    • Biotech
    • Careers
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Software
    • Battery Technology
    • Controlled Environments
      • Cleanrooms
      • Graphene
      • Lasers
      • Regulations/Standards
      • Sensors
    • Imaging
    • Nanotechnology
    • Scientific Computing
      • Big Data
      • HPC/Supercomputing
      • Informatics
      • Security
    • Semiconductors
  • R&D Market Pulse
  • R&D 100
    • 2025 R&D 100 Award Winners
    • 2025 Professional Award Winners
    • 2025 Special Recognition Winners
    • R&D 100 Awards Event
    • R&D 100 Submissions
    • Winner Archive
  • Resources
    • Research Reports
    • Digital Issues
    • Educational Assets
    • R&D Index
    • Subscribe
    • Video
    • Webinars
    • Content submission guidelines for R&D World
  • Global Funding Forecast
  • Top Labs
  • Advertise
  • SUBSCRIBE

R&D 100 winner of the day: DOWSIL EC-6601 electrically conductive adhesive

By Heather Hall | January 20, 2021

DOWSIL EC-6601, from Dow Performance Silicones, provides a step-change in performance of electrically conductive adhesives, critical for emerging applications in autonomous driving, cameras and 5G base-station applications. It provides high elongation, superior shielding, strong adhesion, durability and conductive performance. Its unique siloxane matrix, enabled by Dow’s backward integration of raw materials, provides novel electrical and mechanical performance to enable the next generation of electronic devices. Elimination of electronic interference is an increasing challenge as electronics get smaller and faster.  Electromagnetic interference (EMI) shielding is critical to enable robust electronic communication and operation of electronic devices. EMI shielding is required to ensure modern electronics do not interfere with each other.  DOWSIL EC-6601 provides a unique combination of adhesion, coupled with high elongation, to maintain contact in both compression and tension. The ability to maintain contact in tension opens new design options for OEMs that results in more robust, long-lasting EMI solutions, ultimately providing consumers with increased functionality and improved electronics

Related Articles Read More >

R&D 100 winners increasing access to care for Parkinson’s
R&D 100 winners: Axalta’s paint system cuts energy consumption by half
R&D 100 Finalist: Sandia’s griDNA gives the grid a sixth sense at the edge
R&D 100 winners predict disease risk on a continental scale
rd newsletter
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, trends, and strategies in Research & Development.
RD 25 Power Index

R&D World Digital Issues

Fall 2024 issue

Browse the most current issue of R&D World and back issues in an easy to use high quality format. Clip, share and download with the leading R&D magazine today.

Research & Development World
  • Subscribe to R&D World Magazine
  • Sign up for R&D World’s newsletter
  • Contact Us
  • About Us
  • Drug Discovery & Development
  • Pharmaceutical Processing
  • Global Funding Forecast

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search R&D World

  • R&D World Home
  • Topics
    • Aerospace
    • Automotive
    • Biotech
    • Careers
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Software
    • Battery Technology
    • Controlled Environments
      • Cleanrooms
      • Graphene
      • Lasers
      • Regulations/Standards
      • Sensors
    • Imaging
    • Nanotechnology
    • Scientific Computing
      • Big Data
      • HPC/Supercomputing
      • Informatics
      • Security
    • Semiconductors
  • R&D Market Pulse
  • R&D 100
    • 2025 R&D 100 Award Winners
    • 2025 Professional Award Winners
    • 2025 Special Recognition Winners
    • R&D 100 Awards Event
    • R&D 100 Submissions
    • Winner Archive
  • Resources
    • Research Reports
    • Digital Issues
    • Educational Assets
    • R&D Index
    • Subscribe
    • Video
    • Webinars
    • Content submission guidelines for R&D World
  • Global Funding Forecast
  • Top Labs
  • Advertise
  • SUBSCRIBE