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High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature

By R&D Editors | January 28, 2011

MasterBondEpoxy-250Formulated for structural applications in extreme environments with
temperatures from -80 degrees F to +425 degrees F, Master Bond
Supreme 33 has superior resistance to thermal cycling, thermal
shock and impact.

This toughened, two-component epoxy offers high structural bond
strength to a wide variety of substrates including metals, glass,
ceramics, wood, vulcanized rubbers and many plastics. Supreme 33
also resists chemicals including water, oil and many organic
solvents.

Supreme 33 has a mix ratio of 100 to 70 by weight or 1 to 1 by
volume. It cures conveniently at room temperature in 48 to 72
hours. For optimal performance, the suggested schedule is curing
overnight at room temperature followed by 2 to 3 hours at 150 to
200 degrees F. This 100% reactive epoxy does not contain any solvents
or diluents, has exceptional dimensional stability and features
very low shrinkage upon cure.

It produces high performance bonds boasting a shear strength
over 2,500 psi, a tensile shear strength greater than 7,500 psi and
a T-peel strength exceeding 15 pli. With a volume resistivity of 10
14 ohm-cm, a dielectric strength over 400 volts/mil, and a
dielectric constant of 3.8 at 75 degrees F, Supreme 33 is an
outstanding electrical insulator that is widely used in the
electronic, electrical, aerospace and OEM industries. Supreme 33 is
also available in a non-drip version called Supreme 33ND.

SOURCE: Master Bond

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