Research & Development World

  • R&D World Home
  • Topics
    • Aerospace
    • Automotive
    • Biotech
    • Careers
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Software
    • Battery Technology
    • Controlled Environments
      • Cleanrooms
      • Graphene
      • Lasers
      • Regulations/Standards
      • Sensors
    • Imaging
    • Nanotechnology
    • Scientific Computing
      • Big Data
      • HPC/Supercomputing
      • Informatics
      • Security
    • Semiconductors
  • R&D Market Pulse
  • R&D 100
    • Call for Nominations: The 2025 R&D 100 Awards
    • R&D 100 Awards Event
    • R&D 100 Submissions
    • Winner Archive
    • Explore the 2024 R&D 100 award winners and finalists
  • Resources
    • Research Reports
    • Digital Issues
    • R&D Index
    • Subscribe
    • Video
    • Webinars
  • Global Funding Forecast
  • Top Labs
  • Advertise
  • SUBSCRIBE

High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature

By R&D Editors | January 28, 2011

MasterBondEpoxy-250Formulated for structural applications in extreme environments with
temperatures from -80 degrees F to +425 degrees F, Master Bond
Supreme 33 has superior resistance to thermal cycling, thermal
shock and impact.

This toughened, two-component epoxy offers high structural bond
strength to a wide variety of substrates including metals, glass,
ceramics, wood, vulcanized rubbers and many plastics. Supreme 33
also resists chemicals including water, oil and many organic
solvents.

Supreme 33 has a mix ratio of 100 to 70 by weight or 1 to 1 by
volume. It cures conveniently at room temperature in 48 to 72
hours. For optimal performance, the suggested schedule is curing
overnight at room temperature followed by 2 to 3 hours at 150 to
200 degrees F. This 100% reactive epoxy does not contain any solvents
or diluents, has exceptional dimensional stability and features
very low shrinkage upon cure.

It produces high performance bonds boasting a shear strength
over 2,500 psi, a tensile shear strength greater than 7,500 psi and
a T-peel strength exceeding 15 pli. With a volume resistivity of 10
14 ohm-cm, a dielectric strength over 400 volts/mil, and a
dielectric constant of 3.8 at 75 degrees F, Supreme 33 is an
outstanding electrical insulator that is widely used in the
electronic, electrical, aerospace and OEM industries. Supreme 33 is
also available in a non-drip version called Supreme 33ND.

SOURCE: Master Bond

Related Articles Read More >

Marine-biodegradable polymer is as strong as nylon
Unilever R&D head lifts lid on AI, robots and beating the ‘grease gap’
First CRISPR-edited spider spins red fluorescent silk
KIST carbon nanotube supercapacitor holds capacity after 100,000 cycles
rd newsletter
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, trends, and strategies in Research & Development.
RD 25 Power Index

R&D World Digital Issues

Fall 2024 issue

Browse the most current issue of R&D World and back issues in an easy to use high quality format. Clip, share and download with the leading R&D magazine today.

Research & Development World
  • Subscribe to R&D World Magazine
  • Enews Sign Up
  • Contact Us
  • About Us
  • Drug Discovery & Development
  • Pharmaceutical Processing
  • Global Funding Forecast

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search R&D World

  • R&D World Home
  • Topics
    • Aerospace
    • Automotive
    • Biotech
    • Careers
    • Chemistry
    • Environment
    • Energy
    • Life Science
    • Material Science
    • R&D Management
    • Physics
  • Technology
    • 3D Printing
    • A.I./Robotics
    • Software
    • Battery Technology
    • Controlled Environments
      • Cleanrooms
      • Graphene
      • Lasers
      • Regulations/Standards
      • Sensors
    • Imaging
    • Nanotechnology
    • Scientific Computing
      • Big Data
      • HPC/Supercomputing
      • Informatics
      • Security
    • Semiconductors
  • R&D Market Pulse
  • R&D 100
    • Call for Nominations: The 2025 R&D 100 Awards
    • R&D 100 Awards Event
    • R&D 100 Submissions
    • Winner Archive
    • Explore the 2024 R&D 100 award winners and finalists
  • Resources
    • Research Reports
    • Digital Issues
    • R&D Index
    • Subscribe
    • Video
    • Webinars
  • Global Funding Forecast
  • Top Labs
  • Advertise
  • SUBSCRIBE